Packaging design is becoming increasingly complex with a growing use of components for the purpose of improving packaging properties or their increasing functionality. These include inter alia coatings for shelf life extension of foods or RFID-Chips for contactless identification (Radio Frequency Identification). Packaging design has a significant influence on its recyclability. Therefore, the aim of this project was to analyse the impacts of “active” and “intelligent” packaging on recycling processes. Building on this, proposals for measures to secure the mechanical recycling of packaging waste were developed.
Environmentally-related balancing of "intelligent" and "active" packaging systems with regard to their recyclability and dialogue with stakeholders in the disposal and manufacturing industries SUMMARY
Texte | 22/2017
Dr. Siegfried Kreibe, Thorsten Pitschke, Ruth Berkmüller, Monika Bokelmann, Andreas Förster, Dr. Cornelia Stramm, Astrid Pant
3715 37 323 0
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