Packaging design is becoming increasingly complex with a growing use of components for the purpose of improving packaging properties or their increasing functionality. These include inter alia coatings for shelf life extension of foods or RFID-Chips for contactless identification (Radio Frequency Identification). Packaging design has a significant influence on its recyclability. Therefore, the aim of this project was to analyse the impacts of “active” and “intelligent” packaging on recycling processes. Building on this, proposals for measures to secure the mechanical recycling of packaging waste were developed.